The MINILAB is an automatic tabletop reflow soldering system where heat is transferred by condensed steam.
The system is suitable for profiling with standardized production specifications without the need for program or parameter settings. The low soldering temperature and homogeneous heat transfer reduce the thermal load on the soldering assemblies to a minimum. Together with the simple and safe soldering process, this system is ideal for use in development and prototyping. This entry-level system is manually loaded from the top of standard soldering profiles and is easy to move.
Soldering is possible regardless of the weight of the assembly.
